Cleanroom Device Fabrication Experience:

Cleanroom Environment:

• Proficient in working in a 1000* class cleanroom environment.
• Specialized in both optical and e-beam lithography.

Optical Lithography:

• Extensive use of tools such as mask aligner and laser writer.
• Competent in handling both positive and negative photoresist.

GaN/AlGaN 2D Electron Gas Hall Device Fabrication:

• Expertise in the fabrication of GaN/AlGaN 2D electron gas hall devices.
• Involved in chip designing using a comprehensive set of instruments.

Instrument Proficiency:

• Adept in the cleanroom bench photoresist coating process.
• Skilled in laser, e-beam, and optical mask alignment.
• Proficient in the development process.
• Experienced in oxygen and argon plasma cleaning.
• Competent in e-beam metal deposition and liftoff techniques.
• Capable of rapid thermal treatment.
• Skilled in inductive coupled plasma etching.
• Expertise in SiN isolation through Plasma-Enhanced Chemical Vapor Deposition (PECVD).
• Proficient in pad and channel opening processes.

Sputtering Techniques:

• Experience with RF and DC (AJA) sputtering tools for soft ferromagnetic thin film deposition, particularly for spintronics devices.

Atomic Layer Deposition:

• Proficient in Atomic Layer Deposition techniques for various oxide depositions, specifically for GaAs/AlGaAs and 2DEG spintronics devices.
• Buffer layer for 4-probe magnetoresistance devices.

Atomic Force Microscopy (AFM):

• Utilized AFM for nanoscopic conduction measurements, particularly in the presence of external magnetic fields.
• Expertise in investigating magnetoresistance at the nanoscopic level.